H05K 2203/0257
Brushing
Official title: Brushing, e.g. cleaning the conductive pattern by brushing or wiping
H05K2203/0257 (Brushing) appears on 56 US grants and 39 published applications in this corpus.
Search patents in H05K- Granted patents
- 56
- Published applications
- 39
- Assignees
- 51
- Inventors
- 141
- Latest grant
- 18 Jul 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 2 |
| 2002 | 2 | 1 |
| 2003 | 1 | 1 |
| 2004 | 2 | 5 |
| 2005 | 1 | 2 |
| 2006 | 3 | 2 |
| 2007 | 2 | 1 |
| 2008 | 1 | 1 |
| 2009 | 1 | 6 |
| 2010 | 0 | 0 |
| 2011 | 2 | 2 |
| 2012 | 1 | 1 |
| 2013 | 3 | 1 |
| 2014 | 1 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 2 | 2 |
| 2018 | 1 | 2 |
| 2019 | 0 | 2 |
| 2020 | 2 | 2 |
| 2021 | 2 | 1 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 3 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Unit unloading system18 Jul 2023US 11,706,875 B2Rokko Systems Pte Ltd
- Maintenance board30 Aug 2022US 11,432,443 B2Fuji Corporation
- Process for removing bond film from cavities in printed circuit boards9 Nov 2021US 11,171,101 B2Raytheon Company
- Vertical circuit board printer9 Feb 2021US 10,917,975 B2Shenzhen Jingjiang Yunchuang Technology Co., Ltd.
- Process for improving performance of sliding rheostat of 5G communication high-frequency signal board20 Oct 2020US 10,813,226 B2Kunshan TVS Electronic Technology Co.,Ltd
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Devices, systems, and methods for making and using circuit assemblies having patterns of deformable conductive material formed therein11 Jul 2024US 2024/0237205 A9Liquid Wire Inc.
- Devices, systems, and methods for making and using highly sustainable circuits2 May 2024US 2024/0147631 A1Liquid Wire Inc.
- Devices, systems, and methods for making and using circuit assemblies having patterns of deformable conductive material formed therein25 Apr 2024US 2024/0138062 A1Liquid Wire Inc.
- Process for removing bond film from cavities in printed circuit boards30 Sep 2021US 2021/0305187 A1Raytheon Company
Most cited
By later US patents
- Method and apparatus for aligning solder balls121US 4,871,110 AHitachi, Ltd. · 1989
- Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards52US 5,466,908 AFujitsu Limited · 1995
- Ultra fine particle film forming method and apparatus41US 6,991,515 B2Secretary of Agency of Industrial Science and Technology · 2006
- Method and compact machine for treating printed circuit cards40US 4,589,926 AAB Holmstrands Platindustri · 1986
- Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards31US 5,319,183 AFujitsu Limited · 1994