Devices, systems, and methods for making and using circuit assemblies having patterns of deformable conductive material formed therein
AssigneeLiquid Wire Inc.
InventorsMark S. Kruskopf, Katherine M. Nelson, Jesse Michael Martinez, Michael Austin Clarke, Mark William Ronay
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Abstract
Devices, systems, and methods for making and using circuit assemblies having a pattern of deformable conductive material formed therein are disclosed herein. In various aspects, a circuit assembly can include a substrate layer; a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil; and a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.
Claims20
A method for manufacturing a circuit assembly, the method comprising:
- providing a substrate layer comprising a substrate material;
- placing a removable stencil comprising a stencil material on a surface of the substrate layer, wherein the removable stencil has a thickness and a pattern of passages formed therein;
- depositing a deformable conductive material to at least partially fill the pattern of passages;
- removing the removable stencil from the surface of the substrate layer to leave a first pattern of deformable conductive material formed on the substrate layer, wherein the first pattern of deformable conductive material can comprise at least one gap;
- covering at least a portion of the first pattern of deformable conductive material with a first stacked layer, wherein the first stacked layer is an insulation layer, an encapsulation layer, or a combination thereof;
- and
- unitizing the circuit assembly, wherein unitizing the circuit assembly causes the at least one gap to heal.
A circuit assembly comprising:
- a substrate layer;
- a first pattern of deformable conductive material formed on a surface of the substrate layer using a removable stencil;
- and
- a first stacked layer configured to cover at least a portion of the first pattern of deformable conductive material.
Dependencies are inferred from the claim text.