Process for improving performance of sliding rheostat of 5G communication high-frequency signal board

A process for improving a performance of a sliding rheostat of 5G communication high-frequency signal board, the sliding rheostat sliding between two bonding pads, the process comprising the following steps:

• outer layer etching:
• providing a pre-plugging position between the two bonding pads;
• making an opening window on an outer layer of the 5G communication high-frequency signal board exposed material at the pre-plugging position when the outer layer of the 5G communication high-frequency signal board is exposed;
• wherein an edge of the opening window is 8 to 12 mil away from an edge of the bonding pad;
• resin plugging:
• a. plugging resinous ink into the pre-plugging position, wherein the resinous ink used has a fluidity that is greater than or equal to 1 mm and a Engler viscosity of 150 s to 300 s at a temperature of 20° C.;
• the resinous ink is a single-component thermohardening plugging ink;
• the single-component thermohardening plugging ink comprises 45% to 60% of epoxy resin, 40% to 55% of calcium carbonate filler, and 4% to 14% of curing agent, the above percentages are mass percentages;
• and
• b. baking:
• after the plugging is completed, placing the 5G communication high-frequency signal board on a baking plate inside an oven;
• baking the 5G communication high-frequency signal board at a temperature of 70 to 80° C. for 10 to 20 min;
• and then baking at a temperature of 120 to 180° C. for 20 to 40 min;
• and
• board polishing:
• processing a plugged board with a ceramic brush;
• then polishing a surface of the 5G communication high-frequency signal board that is polished by the ceramic brush with a non-woven fabric brush;
• wherein an altitude difference between a copper surface and a resin surface is less than 5 μm.