Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards

A printed wiring board cleaning method for a cleaning apparatus which includes actuating means for holding and moving a printed wiring board, and laser beam irradiation means for irradiating a laser beam onto opposite surfaces of the printed wiring board held by the actuating means, comprising the steps of:

• operating the actuating means such that portions of opposite surfaces of the printed wiring board to be cleaned with the laser beam face the laser beam irradiation means and are moved transversely relative to said laser beam;
• and
• emitting the laser beam from the laser beam irradiation means and shaping the laser beams emitted from the laser beam irradiation means into strips such that each of the portions on opposite surfaces of the printed wiring board to be cleaned is irradiated with laser beam strips obliquely from two directions relative to the transversely moving portions to be cleaned, to thereby dry-clean said portions on opposite surfaces of the printed wiring board.

An apparatus for cleaning a printed wiring board by using a laser beam, comprising:

• actuating means for holding and moving the printed wiring board;
• and
• laser beam irradiation means, including means for shaping the laser beam emitted from each of said irradiation means into a strip and for irradiating said laser beam strip such that an identical portion of the printed wiring board held by the actuating means is irradiated with laser beam strips obliquely from two directions relative to the portion being cleaned.