Devices, systems, and methods for making and using highly sustainable circuits

A method for manufacturing a highly sustainable circuit assembly comprising:

• providing a substrate layer;
• placing a first stacked layer on a surface of the substrate layer, the first stacked layer comprising a first pattern of passages formed therein;
• depositing a deformable conductive material to at least partially fill the first pattern of passages;
• removing excess deformable conductive material from the first stacked layer;
• and
• reusing the excess deformable conductive material removed from the first stacked layer;
• wherein a resistance of the reused excess deformable conductive material is equal to a resistance of the deposited deformable conductive material.