H05K 2203/0221
Perforating
H05K2203/0221 (Perforating) appears on 26 US grants and 30 published applications in this corpus.
Search patents in H05K- Granted patents
- 26
- Published applications
- 30
- Assignees
- 28
- Inventors
- 73
- Latest grant
- 15 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 1 | 5 |
| 2007 | 1 | 0 |
| 2008 | 2 | 4 |
| 2009 | 3 | 1 |
| 2010 | 0 | 0 |
| 2011 | 2 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 3 |
| 2016 | 2 | 0 |
| 2017 | 2 | 2 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 2 | 4 |
| 2021 | 0 | 1 |
| 2022 | 2 | 2 |
| 2023 | 2 | 1 |
| 2024 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for manufacturing printed wiring board and resin sheet with inorganic layer15 Oct 2024US 12,120,827 B2Ajinomoto Co., Inc.
- Crimp terminal-equipped flexible printed circuit board and method for manufacturing same26 Mar 2024US 11,942,708 B2Nippon Mektron, Ltd.
- Light-emitting module21 Mar 2023US 11,611,014 B2Nichia Corporation
- Device and method for producing an electrical connecting contact on a coated metal sheet17 Jan 2023US 11,558,965 B2voestalpine Stahl GmbH
- Method for manufacturing flexible circuit board29 Nov 2022US 11,516,926 B2Innolux Corporation
- Circuit board and method of fabricating circuit board19 Dec 2024US 2024/0422896 A1Samsung Electro-Mechanics Co., Ltd.
- Method for producing a circuit board and a shaped part for use in this method7 Dec 2023US 2023/0397332 A1Jumatech GmbH
- Crimp terminal-equipped flexible printed circuit board and method for manufacturing same15 Sep 2022US 2022/0294135 A1Nippon Mektron, Ltd.
- Light-emitting module12 May 2022US 2022/0149233 A1Nichia Corporation
- Method for manufacturing printed wiring board and resin sheet with inorganic layer14 Jan 2021US 2021/0014974 A1Ajinomoto Co., Inc.
Most cited
By later US patents
- Method of interconnecting conductors of different layers of a multilayer printed circuit board75US 4,663,840 AU. S. Philips Corporation · 1987
- Method and apparatus for producing a wiring board, including film-peeling19US 7,481,901 B2Ngk Spark Plug Co., Ltd. · 2009
- Method for preparing a double-sided flexible circuit board with electrical connection at a through-hole17US 5,131,141 AShin-Etsu Polymer Co., Ltd. · 1992
- Throughplating of flexible printed boards4US 7,000,845 B2Giesecke & Devrient GmbH · 2006
- Fabric type semiconductor device package and methods of installing and manufacturing same4US 7,638,885 B2Korea Advanced Institute of Science and Technology · 2009