Throughplating of flexible printed boards
AssigneeGiesecke & Devrient GmbH
InventorsAndo Welling, Matthias Bergmann, Joachim Hoppe
Life of this patent
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Abstract
For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.
Claims4
A substrate for a card with an integrated circuit, the substrate being coated on two opposing top and bottom surfaces, each surface having an electrically conductive material layer thereon, and each of the electrically conductive layers being electrically interconnected through the substrate, characterized by a cut-shaped passage going through at least one of the substrate or the two electrically conductive layers, wherein the cut-shaped passage extends obliquely to the surfaces, and tabs are produced by the cut-shaped passage, which tabs are urged past each other so that the conductive layer on the top surface of the substrate touches the conductive layer on the bottom surface of the substrate.
Dependencies are inferred from the claim text.