Method and apparatus for producing a wiring board, including film-peeling
AssigneeNgk Spark Plug Co., Ltd.
InventorsYasushi Toyoda, Nobuyuki Tanaka
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a wiring board offering efficient operations of peeling and collection of a protective film as well as preventing a lowered yield. A method for manufacturing a build-up multilayer resin wiring board, which includes a taping process S2 and a peeling process S3. In the taping process S2, two sheets of substrate are supported and adjoined under the condition that the edges thereof are placed close to each other, and a tape is affixed so that the protective film may be connected on the edge of the substrate. In the peeling process S3, the protective films connected to each other are continuously peeled by sequentially lifting them via the tapes so that an interlayer insulation material may remain on the substrate.
Claims9
A method for manufacturing a wiring board through a process that peels protective films (12) from a substrate (15) having an insulation material layer (14) protected by said protective films (12), which comprises:
- a taping process (S2) which supports a plurality of the substrates (15) that are placed close to each other, and affixes flexible tapes (31) to edges (18, 19) of the substrates (15) so as to connect said protective films (12);
- and
- a peeling process (S3) which continuously peels said protective films (12) connected to each other by lifting them sequentially via said tapes (31) after said taping process so that said insulation material layer (14) may remain on said substrate (15).
A method for manufacturing a wiring board through a process that peels protective films (12) from a plurality of substrates (15) having an insulation material layer (14) protected by said protective films (12), which comprises:
- a peeling opportunity portion formation process (S1) which forms a peeling opportunity portion (16) on a periphery of said protective films (12);
- a taping process (S2) which supports a plurality of the substrates (15) adjoined under the condition where edges (18, 19) of the substrates are placed close to each other after said peeling opportunity portion formation process (S1), and which affixes flexible tapes (31) so that said protective films (12) may be connected to each other in said peeling opportunity portion (16);
- and
- a peeling process (S3) which continuously peels said protective films (12) connected to each other by lifting them sequentially through said tapes (31) after said taping process (S2) so that said insulation material layer (14) may remain on said substrates (15).
A method for manufacturing a wiring board through a process that peels a protective films (12) from a plurality substrates (15) having an insulation material layer (14) protected by said protective films (12), which comprises:
- a through-hole formation process (S1) which forms a plurality of through-holes (16) by piercing a periphery portion of said protective films 12 with a plurality of needles (57);
- a taping process (S2) which supports a plurality of the substrates (15) adjoined under the condition that the edges (18, 19) of the substrates are placed close to each other after said through-hole formation process (S1), and which affixes flexible tapes (31) so that said protective films (12) may be connected to each other at an air pocket (17) formed around said through-holes (16);
- and
- a peeling process (S3) which continuously peels said protective films (12) connected to each other by lifting them sequentially via said tapes (31) after said taping process (S2) so that said insulation material layer (14) may remain on said substrate (15).
Dependencies are inferred from the claim text.