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US 11,516,926 B2Granted
Method for manufacturing flexible circuit board
AssigneeInnolux Corporation
InventorsPai-Chi Tsai, Wen-Chieh Lin
Life of this patent
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Abstract
A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.
Claims18
A method for manufacturing a flexible circuit board, comprising:
- providing a carrier substrate;
- forming a flexible substrate on the carrier substrate;
- forming a plurality of circuit strings on the flexible substrate;
- cutting the flexible substrate to form a plurality of circuit tapes;
- and
- connecting at least a portion of the plurality of circuit tapes to form a circuit chain after cutting the flexible substrate.
3 more elements
Dependencies are inferred from the claim text.