Method for producing a circuit board and a shaped part for use in this method
AssigneeJumatech GmbH
InventorPhilipp WÖLFEL
Life of this patent
Estimating the term…
Loading patent…
AssigneeJumatech GmbH
InventorPhilipp WÖLFEL
Estimating the term…
A method for producing a circuit board and a shaped part for use in this method are provided. To simplify the production of circuit boards, save insulating material and thereby also reduce the height of the circuit board for efficient heat management, the method according to the invention for producing circuit boards comprises the following steps: Step A: providing an electrically conducting shaped part (1) with at least two segments (2a-g), which are integrally connected just by webs of material (M); Step B: embedding the segments (2a-g) in insulating material to form at least one circuit-board substrate (LS); Step C: applying a conductor structure (4a, 4b) to the circuit-board substrate (LS) to form the circuit board (LP); and Step D: releasing the integral connection of the segments (2a-g) by breaking through the webs of material (M).
1-8. (canceled)
A method for manufacturing circuit boards, comprising:
Dependencies are inferred from the claim text.