Method of interconnecting conductors of different layers of a multilayer printed circuit board
AssigneeU.S. Philips Corporation
InventorsHenricus D. U. Ubbens, Peer Langeveld
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Abstract
The invention relates to a method of interconnecting conductors of different layers of a multilayer printed circuit board by forming a depression in the relevant conductor of the outermost layer, so that the insulation layer(s) is deformed and contact is made between the outermost layer and the appropriate conductor(s) of the next layer or layers. The method can suitably be used in multilayer printed circuits on a substrate and in flexible multilayer printed circuits on an electrically insulating foil. In the latter case a temporary backing surface is required for the depression process. The substrate or the temporary backing surface must be deformable to a sufficient degree.
Claims4
A method of manufacturing a multilayer printed circuit board having plural circuit layers separated by at least one deformable insulation layer, in which method conductors of different layers are interconnected by forming at least one depression in a first circuit layer at the location of the conductors to be interconnected, such that the insulation is deformed until the relevant conductor of the first circuit layer contacts the relevant conductor or conductors of one or moe other circuit layers, characterized in that the multilayer printed circuit board is placed on a deformable substrate at least during the depression process, and in that the first circuit layer is depressed beyond the level of the other circuit layer(s), thus bringing about such a deformation of the circuit layers and the layer(s) of insulation between the circuit layers, that the circuit layers become interconnected at the location of the depression.
A method of interconnecting conductors of different circuit layers of a multilayer printed circuit board of the type comprising a deformable insulating layer with conductor layers on opposite sides thereof, said method comprising the steps of
- placing said board on a deformable substrate,
- depressing a first conductor layer at the location of the conductors to be interconnected, said first conductor layer being depressed beyond the level of the other conductor layers, thereby deforming the layer of insulation therebetween, said conductor layers and layer of insulation therebetween being so deformed that the conductors are interconnected at the location of the depression, said board remaining on said substrate at least during the depression process.
Dependencies are inferred from the claim text.