H05K 2203/025
Abrading
Official title: Abrading, e.g. grinding or sand blasting
H05K2203/025 (Abrading) appears on 487 US grants and 446 published applications in this corpus.
Search patents in H05K- Granted patents
- 487
- Published applications
- 446
- Assignees
- 260
- Inventors
- 1,194
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 8 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 10 | 0 |
| 1995 | 8 | 0 |
| 1996 | 9 | 0 |
| 1997 | 15 | 0 |
| 1998 | 11 | 0 |
| 1999 | 15 | 0 |
| 2000 | 12 | 0 |
| 2001 | 15 | 19 |
| 2002 | 18 | 16 |
| 2003 | 20 | 17 |
| 2004 | 18 | 19 |
| 2005 | 9 | 14 |
| 2006 | 11 | 15 |
| 2007 | 8 | 17 |
| 2008 | 5 | 15 |
| 2009 | 8 | 27 |
| 2010 | 11 | 29 |
| 2011 | 13 | 18 |
| 2012 | 27 | 16 |
| 2013 | 18 | 20 |
| 2014 | 16 | 19 |
| 2015 | 14 | 28 |
| 2016 | 9 | 14 |
| 2017 | 10 | 16 |
| 2018 | 14 | 15 |
| 2019 | 13 | 11 |
| 2020 | 18 | 22 |
| 2021 | 15 | 17 |
| 2022 | 13 | 18 |
| 2023 | 10 | 19 |
| 2024 | 17 | 10 |
| 2025 | 9 | 10 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Module including metal member with protruding portion and method for manufacturing module29 Sep 2026US 12,750,992 B2Murata Manufacturing Co., Ltd.
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Insulating circuit board and semiconductor device in which same is used24 Feb 2026US 12,563,665 B2Niterra Materials Co., Ltd.
- Electronic device including outer housing plated with conductive member and manufacturing method therefor3 Feb 2026US 12,540,402 B2Intops Co., Ltd.
- Wiring board stacked body and method of manufacturing wiring board stacked body2 Jul 2026US 2026/0190221 A1Daiwa Co., Ltd.
- Insulating circuit board and semiconductor device in which same is used4 Jun 2026US 2026/0156744 A1Niterra Materials Co., Ltd.
- Component Carrier With Embedded Trace Having Lateral Walls Slanted Inwardly Beginning From an Exterior Surface And Having An Opposing Rounded Edge14 May 2026US 2026/0136969 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Removal apparatus and method using the same7 May 2026US 2026/0129764 A1Aivres Systems Inc.
- Fan-out wafer level packaging unit15 Jan 2026US 2026/0018505 A1Walton Advanced Engineering Inc.
Most cited
By later US patents
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Embedded 3D interposer structure183US 8,426,961 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Trenching techniques for forming channels, vias and components in substrates116US 5,219,787 AMicroelectronics and Computer Technology Corporation · 1993