H05K 2203/0207
Partly drilling through substrate until a controlled depth
Official title: Partly drilling through substrate until a controlled depth, e.g. with end-point detection
H05K2203/0207 (Partly drilling through substrate until a controlled depth) appears on 174 US grants and 195 published applications in this corpus.
Search patents in H05K- Granted patents
- 174
- Published applications
- 195
- Assignees
- 133
- Inventors
- 526
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 5 | 7 |
| 2003 | 3 | 4 |
| 2004 | 2 | 3 |
| 2005 | 3 | 6 |
| 2006 | 1 | 6 |
| 2007 | 6 | 6 |
| 2008 | 3 | 7 |
| 2009 | 4 | 2 |
| 2010 | 2 | 4 |
| 2011 | 0 | 5 |
| 2012 | 5 | 5 |
| 2013 | 5 | 3 |
| 2014 | 1 | 7 |
| 2015 | 1 | 18 |
| 2016 | 14 | 11 |
| 2017 | 11 | 5 |
| 2018 | 8 | 9 |
| 2019 | 9 | 11 |
| 2020 | 6 | 6 |
| 2021 | 10 | 17 |
| 2022 | 12 | 10 |
| 2023 | 6 | 12 |
| 2024 | 6 | 9 |
| 2025 | 9 | 12 |
| 2026 | 4 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Real-time control of via stub drilling depth asymmetry28 Jul 2026US 12,696,396 B2International Business Machines Corporation
- Method of forming high aspect ratio plated through holes10 Mar 2026US 12,575,036 B2Sanmina Corporation
- Zero clearance backdrilled printed circuit boards17 Feb 2026US 12,557,217 B2Nokia Solutions and Networks Oy
- Circuit board structure and method for forming the same23 Sep 2025US 12,426,168 B2Unimicron Technology Corp.
- Through hole via with blind via for cable attachment6 Aug 2026US 2026/0231326 A1Teradyne, Inc.
- Wiring board30 Jul 2026US 2026/0223287 A1Shinko Electric Industries Co., Ltd.
- Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board9 Jul 2026US 2026/0197948 A1Sanmina Corporation
- Method for manufacturing wiring board, and wiring board11 Jun 2026US 2026/0164562 A1Disco Corporation
- Printed circuit board, electronic device, and printed circuit board preparation method12 Mar 2026US 2026/0075714 A1Zte Corporation
Most cited
By later US patents
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- Laser beam scanning method for forming via holes in polymer materials168US 4,894,115 AGeneral Electric Company · 1990
- Method of manufacturing multilayer printed wiring board145US 5,826,330 AHitachi AIC Inc. · 1998
- Backplane for radio frequency signals134US 6,392,160 B1Lucent Technologies Inc. · 2002
- Fine dimension stacked vias for a multiple layer circuit board structure119US 5,699,613 AInternational Business Machines Corporation · 1997