H05K 2203/0292
Using vibration
Official title: Using vibration, e.g. during soldering or screen printing
H05K2203/0292 (Using vibration) appears on 86 US grants and 81 published applications in this corpus.
Search patents in H05K- Granted patents
- 86
- Published applications
- 81
- Assignees
- 74
- Inventors
- 205
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 1 |
| 2003 | 1 | 4 |
| 2004 | 1 | 3 |
| 2005 | 3 | 4 |
| 2006 | 2 | 5 |
| 2007 | 2 | 3 |
| 2008 | 1 | 5 |
| 2009 | 6 | 11 |
| 2010 | 4 | 8 |
| 2011 | 4 | 1 |
| 2012 | 8 | 4 |
| 2013 | 1 | 0 |
| 2014 | 1 | 2 |
| 2015 | 0 | 3 |
| 2016 | 2 | 4 |
| 2017 | 1 | 3 |
| 2018 | 3 | 5 |
| 2019 | 3 | 1 |
| 2020 | 2 | 2 |
| 2021 | 3 | 2 |
| 2022 | 0 | 0 |
| 2023 | 2 | 3 |
| 2024 | 2 | 4 |
| 2025 | 0 | 0 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Display device and manufacturing method of display device20 Aug 2024US 12,069,910 B2Samsung Display Co., Ltd.
- Optical light emitting device, manufacturing method thereof, and optical light emitting element16 Jul 2024US 12,038,140 B2Japan Display Inc.
- Substrate with buried component and manufacture method thereof17 Oct 2023US 11,792,939 B2Unimicron Technology Corp.
- Ultrasonic-assisted solder transfer3 Jan 2023US 11,541,472 B2International Business Machines Corporation
- Element transfer device and method for controlling the same27 Aug 2026US 2026/0255499 A1Chungang University Industry Academic Cooperation Foundation
- Hybrid-material leads for solderless coupling of an electronic component28 May 2026US 2026/0150713 A1Semiconductor Components Industries, LLC
- Circuit board and manufacturing method11 Jul 2024US 2024/0234366 A9NHK Spring Co., Ltd.
- Method for manufacturing wiring board or wiring board material2 May 2024US 2024/0147633 A1Daiwa Co., Ltd.
- Circuit board and manufacturing method25 Apr 2024US 2024/0136325 A1NHK Spring Co., Ltd.
Most cited
By later US patents
- Process for coating surfaces made tacky beforehand93US 5,167,989 AE. I. Du Pont de Nemours and Company · 1992
- Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package91US 5,839,191 AUnisys Corporation · 1998
- Soldering process43US 5,088,639 AMotorola, Inc. · 1992
- Component and solder preform placement device and method of placement34US 5,205,896 AHughes Aircraft Company · 1993
- Method of transferring conductive balls32US 5,657,528 AMatsushita Electric Industrial Co., Ltd. · 1997