Method for manufacturing wiring board or wiring board material
AssigneeDaiwa Co., Ltd.
InventorEiji YOSHIMURA
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a wiring board or a wiring board material includes: obtaining a laminated body LB including the wiring board or the wiring board material having an opening, an embedded member 14 positioned inside the opening, and a cured product of a filling sheet or a coating layer that is integrated with the wiring board or the wiring board material and contains a thermosetting resin 17, the thermosetting resin 17 being filled between an inner surface of the opening of the wiring board or the wiring board material and the embedded member; and removing the cured product of the filling sheet or the coating layer by grinding to obtain a constant thickness of the laminated body.
Claims7
A method for manufacturing a wiring board or a wiring board material, comprising the steps of:
- obtaining a laminated body including
- the wiring board or the wiring board material having an opening,
- an embedded member positioned in the opening,
- a cured product of a filling sheet or a coating layer that is integrated with the wiring board or the wiring board material and contains a thermosetting resin, the thermosetting resin being filled between an inner surface of the opening of the wiring board or the wiring board material and the embedded member, and
- a resin film having an opening at a position corresponding to the opening of the wiring board or the wiring board material, the resin film is attached to the wiring board or the wiring board material:
- removing the cured product of the filling sheet or the coating layer by grinding to obtain a constant thickness of the laminated body so that a part of the resin film is removed;
- and
- peeling a remaining part of the resin film from the laminated body.
Dependencies are inferred from the claim text.