Component and solder preform placement device and method of placement
AssigneeHughes Aircraft Company
InventorsRaymond L. Brown, Gerald B. Smith
Life of this patent
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AssigneeHughes Aircraft Company
InventorsRaymond L. Brown, Gerald B. Smith
Estimating the term…
Discrete solder preforms (28, 14a, 14b, 14c) are quickly and accurately placed on substrates (10) to be soldered by means of a foil sheet (24) apertured (26) with the pattern of preform placement. The foil sheet has a vacuum drawn through its apertures, and a number of discrete solder preforms are randomly projected from a vibratory membrane (38) up against the foil to be attached to the foil at each of its apertures. Then the foil sheet with its vacuum attached solder preforms (28, 14a, 14b, 14c) is moved into registration with the flux pattern (12a, 12b, 12c) pre-printed on the substrate (10), and all of the vacuum attached preforms are simultaneously positioned down upon the flux areas of the substrate where they remain when the vacuum is released. Planarity of the thin foil is maintained by a flat somewhat rigid but porous backing member (32) secured to the foil.
A method of placing discrete items in a predetermined pattern on a substrate comprising the steps of:
Apparatus for patterned placement of items on a substrate comprising:
Apparatus for placing spherical solder preforms onto a substrate pre-printed with a predetermined flux pattern, said pattern comprising:
Dependencies are inferred from the claim text.