Soldering process
AssigneeMotorola, Inc.
InventorsVinay Gondotra, Kiron P. Gore, Steven T. Bogert
Life of this patent
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Abstract
A soldering process uses a plurality of individual heating elements (204) to solder a plurality of solder locations. The process consists of the steps of substantially simultaneously picking up a plurality of solder preforms (202); placing the plurality of solder preforms substantially simultaneously on different interconnection locations (214) found on a circuit board (212); and substantially simultaneously soldering the plurality of solder preforms (202) with a heating element fixture (200) which has a plurality of individual heating elements (204) which match the different interconnection locations (214) found on the circuit board (212).
Claims8
A soldering process, comprising the steps of:
- substantially simultaneously picking up a plurality of solder preforms using a multi-point vacuum pickup tool having a pattern of cupped shaped heads that match the pattern formed by the different preselected interconnection locations found on a circuit board;
- substantially simultaneously placing the plurality of solder preforms on different preselected interconnection locations found on the circuit board;
- and
- substantially simultaneously soldering the plurality of solder preforms with a heating element fixture.
A soldering process, comprising the steps of:
- substantially simultaneously picking up a plurality of substantially spherical solder preforms from an oscillating container filled with solder preforms using a multi-point vacuum pickup tool having a pattern of cupped shaped heads that match the pattern formed by the different preselected interconnection locations found on a circuit board;
- checking to make sure that all of the plurality of substantially spherical solder preforms have been picked up;
- fluxing the plurality of solder preforms;
- substantially simultaneously placing the plurality of substantially spherical solder preforms on different preselected interconnection locations found on the circuit board;
- and
- substantially simultaneously soldering the plurality of substantially spherical solder preforms with a heating element fixture which has a plurality of individual heating elements which match the different preselected interconnection locations found on the circuit board.
Dependencies are inferred from the claim text.