H05K 2201/0959
Plated through-holes or plated blind vias filled with insulating material
H05K2201/0959 (Plated through-holes or plated blind vias filled with insulating material) appears on 651 US grants and 646 published applications in this corpus.
Search patents in H05K- Granted patents
- 651
- Published applications
- 646
- Assignees
- 265
- Inventors
- 1,380
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 8 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 12 | 0 |
| 1998 | 11 | 0 |
| 1999 | 14 | 0 |
| 2000 | 22 | 0 |
| 2001 | 33 | 16 |
| 2002 | 35 | 35 |
| 2003 | 31 | 38 |
| 2004 | 33 | 42 |
| 2005 | 21 | 34 |
| 2006 | 21 | 36 |
| 2007 | 19 | 28 |
| 2008 | 26 | 49 |
| 2009 | 25 | 53 |
| 2010 | 18 | 18 |
| 2011 | 31 | 26 |
| 2012 | 34 | 22 |
| 2013 | 22 | 23 |
| 2014 | 14 | 12 |
| 2015 | 14 | 12 |
| 2016 | 7 | 12 |
| 2017 | 21 | 17 |
| 2018 | 12 | 21 |
| 2019 | 17 | 13 |
| 2020 | 22 | 20 |
| 2021 | 10 | 21 |
| 2022 | 25 | 29 |
| 2023 | 15 | 27 |
| 2024 | 20 | 11 |
| 2025 | 10 | 18 |
| 2026 | 11 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Electrical component and method of forming same4 Aug 2026US 12,701,657 B2Medtronic, Inc.
- Wiring substrate28 Jul 2026US 12,696,394 B2Toppan Holdings Inc.
- Vertical conductive structure transition impedance optimization16 Jun 2026US 12,660,083 B2International Business Machines Corporation
- Circuit board and method of manufacturing the same16 Jun 2026US 12,660,093 B2LG Innotek Co., Ltd.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Integrated circuit packages having partial pad vertical interconnect access24 Sep 2026US 2026/0292981 A1Intel Corporation
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Circuit board and method of manufacturing circuit board6 Aug 2026US 2026/0231327 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate and method for manufacturing the same6 Aug 2026US 2026/0231331 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Semiconductor interconnect having laser machined contacts223US 6,294,837 B1Micron Technology, Inc. · 2001
- Method for making printed circuit boards with selectivity filled plated through holes200US 5,487,218 AInternational Business Machines Corporation · 1996