Vertical conductive structure transition impedance optimization
AssigneeInternational Business Machines Corporation
InventorsMatteo Cocchini, Kyle Indukummar Giesen, Egduard Ramon Jauregui, Hung The Hac Nguyen
Life of this patent
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Abstract
A printed circuit board (PCB), vertical conductive structures (VeCSs) for the PCB, and a method of fabricating a printed circuit board (PCB). The VeCS includes a VeCS slot at least partially defined in a dielectric substrate. A vertical signal trace is positioned on a first side of the VeCS slot and a vertical reference trace is positioned on a second side of the VeCS slot opposite the vertical signal trace. The VeCS has a predetermined impedance. A plurality of signal ground planes is positioned at a respective predetermined distance from the vertical signal trace. Each signal ground plane defines a cutout.
Claims19
A vertical conductive structure (VeCS) for a printed circuit board (PCB), comprising:
- a VeCS slot at least partially defined in a dielectric substrate, wherein the VeCS is a single-ended VeCS;
- a vertical signal trace positioned on a first side of the VeCS slot;
- and
- a vertical reference trace positioned on a second side of the VeCS slot opposite the vertical signal trace.
A printed circuit board (PCB), comprising:
- a plurality of vertical conductive structures (VeCSs), wherein one or more VeCSs of the plurality of VeCSs comprising:
- a VeCS slot at least partially defined in a dielectric substrate;
- a vertical signal trace positioned on a first side of the VeCS slot;
- a vertical reference trace positioned on a second side of the VeCS slot opposite the vertical signal trace;
- and
- a plurality of signal ground planes, wherein each signal ground plane of the plurality of signal ground planes is positioned at a respective predetermined distance from the vertical signal trace, and each signal ground plane of the plurality of signal ground planes defines a cutout.
A vertical conductive structure (VeCS) for a printed circuit board (PCB), comprising:
- a VeCS slot at least partially defined in a dielectric substrate, wherein the VeCS is a differential VeCS and a vertical signal trace is a first vertical signal trace;
- the vertical signal trace positioned on a first side of the VeCS slot;
- a vertical reference trace positioned on a second side of the VeCS slot opposite the vertical signal trace, wherein the VeCS has a predetermined impedance;
- and
- a second vertical signal trace positioned on the first side of the VeCS slot, the first and second vertical signal traces are separated by a signal trace separation distance, and the first and second vertical signal traces have similar widths and thicknesses.
A vertical conductive structure (VeCS) for a printed circuit board (PCB), comprising:
- a VeCS slot at least partially defined in a dielectric substrate;
- a vertical signal trace positioned within the VeCS slot;
- and
- a plurality of signal ground planes, wherein each signal ground plane of the plurality of signal ground planes is positioned at a respective predetermined distance from the vertical signal trace, and each signal ground plane of the plurality of signal ground planes defines a cutout.
A method of fabricating a printed circuit board (PCB), comprising:
- fabricating an impedance-controlled vertical conductive structure (VeCS), comprising:
- forming a VeCS slot in a dielectric substrate, wherein the VeCS slot defines a first side of the VeCS slot and an opposing second side of the VeCS slot, and the VeCS is a single-ended VeCS;
- positioning a vertical signal trace on the first side of the VeCS slot;
- and
- positioning a vertical reference trace on the second side of the VeCS slot, wherein the VeCS has a predetermined impedance.
Dependencies are inferred from the claim text.