H05K 2201/09545
Plated through-holes or blind vias without lands
H05K2201/09545 (Plated through-holes or blind vias without lands) appears on 177 US grants and 232 published applications in this corpus.
Search patents in H05K- Granted patents
- 177
- Published applications
- 232
- Assignees
- 116
- Inventors
- 519
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 3 |
| 2004 | 1 | 1 |
| 2005 | 2 | 2 |
| 2006 | 1 | 0 |
| 2007 | 1 | 4 |
| 2008 | 0 | 11 |
| 2009 | 5 | 9 |
| 2010 | 3 | 4 |
| 2011 | 3 | 6 |
| 2012 | 7 | 7 |
| 2013 | 1 | 8 |
| 2014 | 3 | 5 |
| 2015 | 10 | 21 |
| 2016 | 12 | 23 |
| 2017 | 20 | 17 |
| 2018 | 17 | 8 |
| 2019 | 7 | 4 |
| 2020 | 9 | 7 |
| 2021 | 8 | 13 |
| 2022 | 11 | 16 |
| 2023 | 5 | 19 |
| 2024 | 13 | 17 |
| 2025 | 14 | 16 |
| 2026 | 14 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Circuit board and semiconductor package comprising same28 Jul 2026US 12,696,390 B2LG Innotek Co., Ltd.
- Printed circuit board26 May 2026US 12,641,726 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board device24 Sep 2026US 2026/0292971 A1Global Unichip Corporation
- Integrated circuit packages having partial pad vertical interconnect access24 Sep 2026US 2026/0292981 A1Intel Corporation
- Integrated circuit packages having ground paired partial pad vertical interconnect access24 Sep 2026US 2026/0293720 A1Intel Corporation
- Multilayer substrate10 Sep 2026US 2026/0271180 A1Murata Manufacturing Co., Ltd.
- Pcb signal via structure and determination method, determination apparatus, and determination device for pcb signal via structure3 Sep 2026US 2026/0262164 A1Suzhou Metabrain Intelligent Technology Co., Ltd.
Most cited
By later US patents
- Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board79US 6,876,554 B1Ibiden Co., Ltd. · 2005
- Printed circuit board and method for manufacturing printed circuit board46US 7,307,852 B2Ibiden Co., Ltd. · 2007
- Method of fabricating a circuit board34US 4,856,184 ATektronix, Inc. · 1989
- Mating backplane for high speed, high density electrical connector31US 9,775,231 B2Amphenol Corporation · 2017
- Mating backplane for high speed, high density electrical connector31US 9,807,869 B2Amphenol Corporation · 2017