Mating backplane for high speed, high density electrical connector
AssigneeAmphenol Corporation
InventorMarc B. Cartier, Jr.
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.
Claims25
A printed circuit board comprising:
- a plurality of layers including attachment layers and routing layers;
- and
- via patterns formed in the plurality of layers, each of the via patterns comprising:
- first and second signal vias forming a differential signal pair, the first and second signal vias each being configured with a first section having a first diameter and a second section having a second diameter, less than the first diameter;
- and
- ground shadow vias adjacent to each of the first and second signal vias, the ground shadow vias each comprising a first section having a third diameter and a second section having a fourth diameter.
A printed circuit board comprising:
- a plurality of layers including attachment layers and routing layers;
- and
- via patterns formed in the plurality of layers, each of the via patterns comprising:
- dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector;
- dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias;
- and
- ground vias configured to accept contact tails of ground conductors of the connector.
A method of manufacturing a printed circuit board comprising a connector footprint with at least one signal via, at least one signal via connected to a signal trace within the printed circuit board and at least one ground via connected to a ground plane within the printed circuit board, the method comprising:
- drilling a first hole through the printed circuit board, the first hole passing through a pad of the signal trace;
- drilling a second hole through the printed circuit board, the second hole passing through a plurality of ground planes within the printed circuit board;
- from a first surface of the printed circuit board, drilling to expand a diameter of a first section of the first hole;
- from a second surface, opposite the first surface, drilling to expand a diameter of a second section of the second hole;
- plating the first and second holes.
Dependencies are inferred from the claim text.