Method of fabricating a circuit board
AssigneeTektronix, Inc.
InventorWallace D. Doeling
Life of this patent
Estimating the term…
Abstract
A circuit board is fabricated from a substrate of dielectric material having at least one run of conductive material adhered to one surface thereof. A second substrate of dielectric material is bonded to the one surface of the first substrate so as to cover the run of conductive material. A hole is formed through the first and second substrates and intercepts the run of conductive material. Conductive material is introduced into the hole and establishes electrically conductive contact with the run of conductive material. The diameter of the hole is at least as great as the width of the run of conductive material where it is intercepted by the hole.
Claims4
An improved method of fabricating a circuit board, comprising the steps of:
- (a) providing a first substrate of dielectric material having at least one run of conductive material adhered to one surface thereof,
- (b) bonding a second substrate of dielectric material to said one surface of the first substrate, so as to cover the run of conductive material.
- (c) forming a hole through the first and second substrates of dielectric material, which hole intercepts the run of conductive material, and
- (d) depositing conductive material into the hole, the deposited conductive material being in electrically conductive contact with the run of conductive material,
- wherein the improvement resides in that the diameter of the hole is at least as great as the width of the run of conductive material where it is intercepted by the hole.
Dependencies are inferred from the claim text.