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US 6,876,554 B1Granted
Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board
AssigneeIbiden Co., Ltd.
InventorsYasushi Inagaki, Motoo Asai, Dongdong Wang, Hideo Yabashi, Seiji Shirai
Life of this patent
Estimating the term…
Abstract
Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
Claims4
A printed circuit board arrangement comprising:
- a core substrate having a cavity therein, and
- a resin insulating layer and a conductor circuit laminated on the core substrate, and
- a plurality of capacitors accommodated in the cavity, wherein at least a part of electrodes of each capacitor is uncoated with a coating layer and exposed to the outside, and an electric connection for the electrode exposed from the coating layer is established by plating.
Dependencies are inferred from the claim text.