Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Eun Lee, Ki Hwan Kim
Life of this patent
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Abstract
The present disclosure relates to a printed circuit board including: a glass layer; a plurality of blind cavities respectively penetrating through a portion of the glass layer from an upper surface or a lower surface of the glass layer; a plurality of passive elements respectively disposed in the plurality of blind cavities; and an insulating layer covering at least a portion of each of the glass layer and the plurality of passive elements and disposed in at least a portion of each of the plurality of blind cavities. At least two of the plurality of blind cavities have different depths.
Claims20
A printed circuit board, comprising:
- a glass layer;
- a plurality of blind cavities respectively penetrating through a portion of the glass layer from an upper surface or a lower surface of the glass layer;
- a plurality of passive elements respectively disposed in the plurality of blind cavities;
- and
- an insulating layer covering at least a portion of each of the glass layer and the plurality of passive elements and disposed in at least a portion of each of the plurality of blind cavities,
- wherein at least two of the plurality of blind cavities have different depths,
- the plurality of blind cavities include first and second blind cavities respectively penetrating through a portion of the glass layer from the upper surface of the glass layer, and third and fourth blind cavities respectively penetrating through a portion of the glass layer from the lower surface of the glass layer, and
- the plurality of passive elements include first to fourth passive elements respectively disposed in the first to fourth blind cavities.
A printed circuit board, comprising:
- a glass layer;
- a blind cavity penetrating through a portion of the glass layer from an upper surface or a lower surface of the glass layer;
- a through-cavity penetrating between the upper surface and the lower surface of the glass layer;
- a passive element disposed in the blind cavity;
- an electronic component disposed in the through-cavity;
- an insulating layer covering at least a portion of each of the glass layer, the passive element, and the electronic component, and disposed in at least a portion of each of the blind cavity and the through-cavity;
- a first wiring layer disposed on a bottom surface of the blind cavity;
- third and fourth wiring layers respectively disposed on the upper and lower surfaces of the glass layer;
- first and second build-up insulating layers respectively disposed on an upper surface and a lower surface of the insulating layer;
- a first build-up wiring layer disposed on an upper surface of the first build-up insulating layer;
- a second build-up wiring layer disposed on a lower surface of the second build-up insulating layer;
- a first resist layer disposed on an upper surface of the first build-up insulating layer, and covering at least a portion of the first build-up wiring layer;
- and
- a second resist layer disposed on a lower surface of the second build-up insulating layer, and covering at least a portion of the second build-up wiring layer.
A printed circuit board, comprising:
- a glass layer;
- a first blind cavity penetrating through a portion of the glass layer from an upper surface of the glass layer;
- a second blind cavity penetrating through another portion of the glass layer from a lower surface of the glass layer;
- first and second passive elements respectively disposed in the first and second blind cavities, and connected to each other through a first via layer disposed in a portion of the glass layer between the first blind cavity and the second blind cavity;
- and
- an insulating layer covering at least a portion of each of the glass layer and the first and second passive elements and disposed in at least a portion of the first and second blind cavities.
Dependencies are inferred from the claim text.