H05K 13/04
Mounting of components
Official title: Mounting of components {, e.g. of leadless components}
H05K13/04 (Mounting of components) appears on 4,290 US grants and 3,315 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,290
- Published applications
- 3,315
- Assignees
- 1,055
- Inventors
- 6,035
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 25 | 0 |
| 1977 | 22 | 0 |
| 1978 | 22 | 0 |
| 1979 | 27 | 0 |
| 1980 | 25 | 0 |
| 1981 | 26 | 0 |
| 1982 | 25 | 0 |
| 1983 | 36 | 0 |
| 1984 | 35 | 0 |
| 1985 | 52 | 0 |
| 1986 | 91 | 0 |
| 1987 | 61 | 0 |
| 1988 | 78 | 0 |
| 1989 | 102 | 0 |
| 1990 | 70 | 0 |
| 1991 | 67 | 0 |
| 1992 | 83 | 0 |
| 1993 | 75 | 0 |
| 1994 | 76 | 0 |
| 1995 | 42 | 0 |
| 1996 | 61 | 0 |
| 1997 | 39 | 0 |
| 1998 | 73 | 0 |
| 1999 | 72 | 0 |
| 2000 | 100 | 0 |
| 2001 | 111 | 43 |
| 2002 | 88 | 103 |
| 2003 | 95 | 79 |
| 2004 | 80 | 85 |
| 2005 | 72 | 87 |
| 2006 | 66 | 79 |
| 2007 | 54 | 57 |
| 2008 | 42 | 52 |
| 2009 | 38 | 57 |
| 2010 | 48 | 64 |
| 2011 | 40 | 59 |
| 2012 | 57 | 85 |
| 2013 | 56 | 262 |
| 2014 | 104 | 171 |
| 2015 | 147 | 181 |
| 2016 | 147 | 189 |
| 2017 | 153 | 169 |
| 2018 | 178 | 292 |
| 2019 | 227 | 218 |
| 2020 | 232 | 250 |
| 2021 | 206 | 169 |
| 2022 | 213 | 164 |
| 2023 | 136 | 135 |
| 2024 | 127 | 131 |
| 2025 | 128 | 79 |
| 2026 | 60 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 13/0404Pick-and-place heads or apparatus1,373
- H05K 13/046Surface mounting994
- H05K 13/0417Feeding with belts or tapes885
- H05K 13/0486Replacement and removal of components418
- H05K 13/043Feeding one by one by other means than belts349
- H05K 13/0452Mounting machines or lines comprising a plurality of tools for guiding different146
- H05K 13/0473Cutting and clinching the terminal ends of the leads after they are120
- H05K 13/0478Simultaneously mounting of different components118
Recent patents
- Epoxy dispensing device and method of mounting electronic component on substrate by using the same6 Oct 2026US 12,757,367 B2Electronics and Telecommunications Research Institute
- Protection of sensing element during moulding15 Sep 2026US 12,736,428 B2Melexis Technologies SA
- Structural enclosure for protection against foreign object debris and restraint of thermal interface material15 Sep 2026US 12,739,978 B2Raytheon Company
- Processor module installation tool with protective interlock feature15 Sep 2026US 12,740,034 B2International Business Machines Corporation
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Monitoring system and monitoring method8 Oct 2026US 2026/0309148 A1Fuji Corporation
- Linear motion device and electronic component mounting device24 Sep 2026US 2026/0291355 A1Panasonic Intellectual Property Management Co., Ltd.
- Tape feeder24 Sep 2026US 2026/0293075 A1Fuji Corporation
- Component mounting machine and control method24 Sep 2026US 2026/0293077 A1Fuji Corporation
- Conveyance device17 Sep 2026US 2026/0273758 A1TDK Corporation
Most cited
By later US patents
- Apparatus and method for mounting a chip211US 5,839,187 AMatsushita Electric Industrial Co., Ltd. · 1998
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Optical communication device and slip ring unit for an electronic component-mounting apparatus172US 6,353,693 B1Sanyo Electric Co., Ltd. · 2002
- Component mounting method167US 7,353,596 B2Matsushita Electric Industrial Co., Ltd. · 2008
- Component mounting apparatus163US 7,797,820 B2Panasonic Corporation · 2010