H05K 13/0486
Replacement and removal of components
Official title: {Replacement and removal of components}
H05K13/0486 (Replacement and removal of components) appears on 418 US grants and 271 published applications in this corpus.
Search patents in H05K- Granted patents
- 418
- Published applications
- 271
- Assignees
- 188
- Inventors
- 786
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 18 | 0 |
| 1987 | 10 | 0 |
| 1988 | 12 | 0 |
| 1989 | 18 | 0 |
| 1990 | 16 | 0 |
| 1991 | 11 | 0 |
| 1992 | 12 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 5 | 0 |
| 1996 | 13 | 0 |
| 1997 | 2 | 0 |
| 1998 | 14 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 10 | 2 |
| 2002 | 6 | 7 |
| 2003 | 4 | 4 |
| 2004 | 3 | 6 |
| 2005 | 3 | 6 |
| 2006 | 0 | 3 |
| 2007 | 3 | 8 |
| 2008 | 6 | 3 |
| 2009 | 4 | 2 |
| 2010 | 5 | 3 |
| 2011 | 3 | 7 |
| 2012 | 2 | 10 |
| 2013 | 5 | 6 |
| 2014 | 2 | 14 |
| 2015 | 7 | 13 |
| 2016 | 10 | 17 |
| 2017 | 14 | 12 |
| 2018 | 26 | 72 |
| 2019 | 26 | 11 |
| 2020 | 21 | 12 |
| 2021 | 13 | 15 |
| 2022 | 17 | 13 |
| 2023 | 15 | 10 |
| 2024 | 6 | 6 |
| 2025 | 10 | 6 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic device, and disassembling device for disassembling same5 May 2026US 12,621,972 B2Humax Co., Ltd.
- Method of recycling integrated circuits3 Feb 2026US 12,541,746 B2Phinia Jersey Holdings LLC
- Method for heating a soldered joint23 Dec 2025US 12,502,722 B2Schaeffler Technologies AG & Co. KG
- Heating device9 Dec 2025US 12,491,572 B2Schaeffler Technologies AG & Co. KG
- Removing a first board coupled to a second board25 Nov 2025US 12,484,206 B1
- Device, method, and recording medium for controlling substrate processing process10 Sep 2026US 2026/0271256 A1Koh Young Technology Inc.
- Micro-transfer-print repair on same site9 Jul 2026US 2026/0197984 A1
- Method and Device for Separating a Semiconductor Component From a Carrier21 May 2026US 2026/0144007 A1Pac Tech—Packaging Technologies GmbH
- Protective enclosure for electronic circuits11 Dec 2025US 2025/0380366 A1Inventus Holdings, LLC
- Recycling circuit board components23 Oct 2025US 2025/0331142 A1IN2TEC Ltd
Most cited
By later US patents
- Method of electrically connecting an integrated circuit to an electric device146US 5,261,156 ASemiconductor Energy Laboratory Co.Ltd. · 1993
- Soldering/unsoldering arrangement86US 6,257,478 B1Cooper Tools GmbH · 2001
- Electronic module insertion and retraction mechanism77US 4,597,173 AThe United States of America as represented by the Secretary of the Navy · 1986
- Circuit package attachment apparatus and method53US 4,769,525 AHughes Aircraft Company · 1988
- Method of producing an article comprising a multichip assembly52US 4,954,453 AAT&T Bell Laboratories · 1990