Heating device
AssigneeSchaeffler Technologies AG & Co. KG
InventorsCédric Benaben, Stéphane Vitali
Life of this patent
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Abstract
A heating device suitable for heating at least one soldered joint between an electronic component including at least a first contact mound and a printed circuit board. The soldered joint on the one hand securing the electronic component to the printed circuit board and on the other hand, while providing electrical continuity, the electronic component also having an electronic-component width, and an electronic-component thickness, wherein it includes an electrical-connection suitable for being coupled to an electrical power supply and a heater suitable for reaching a temperature at least equal to the melting point of the solder.
Claims13
A heating device comprising:
- a heating means comprising a body having a top surface, a bottom surface, and two side surfaces, the top surface and the bottom surface being contiguous surfaces configured to be arranged between an electronic component and a printed circuit board, the heating means being configured to reach a temperature at least equal to a melting point of a solder;
- and
- electrical-connection means arranged on at least one of the top surface, the bottom surface, or the two side surfaces, the electrical-connection means being configured to be coupled to an electrical power supply,
- wherein the heating device is configured to heat at least one soldered joint between the electronic component and the printed circuit board.
Dependencies are inferred from the claim text.