Method of electrically connecting an integrated circuit to an electric device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsAkira Mase, Hideki Nemoto, Shunpei Yamazaki, Yasuhiko Takemura
Life of this patent
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Abstract
An integrated circuit is mounted on and electrically connected to an electric device with an adhesive therebetween. The adhesive comprises a photo-curable resin and a heat-curable resin. After mounted on the electric device, the integrated circuit is temporarily adhered to the device by exposing the adhesive to a ultraviolet light in order to cure only the photo-curable component of the adhesive. The operation of the electric device connected to the integrated circuit is then tested. If the integrated circuit is faulty, it is replaced. If faultless, the integrated circuit is permanently fixed to the electric device by heating to completely cure the adhesive.
Claims18
A method of electrically connecting an integrated circuit to an electric device comprising the steps of:
- mounting said integrated circuit on said electric device with an adhesive disposed therebetween in order that terminals of said integrated circuit and said electric device to be electrically coupled are aligned with each other, said adhesive comprising a mixture of different substances which are cured in different conditions;
- curing one of said different substances of the same adhesive in a first curing condition in order to temporarily adhere said integrated circuit to said electric device;
- testing either or both of said integrated circuit and the electrical connection thereof with said electric device;
- and
- fixing said integrated circuit to said electric device by curing another of said different substances in a second curing condition different than said first curing condition.
A method of electrically connecting an integrated circuit to an electric device comprising the steps of:
- mounting said integrated circuit on said electric device with an adhesive disposed therebetween in order that terminals of said integrated circuit and said electric device to be electrically coupled are aligned with each other, said adhesive comprising a mixture of different substances which are cured in different conditions;
- curing one of said different substances of the same adhesive in a first curing condition in order to temporarily adhere said integrated circuit to said electric device;
- testing either or both of said integrated circuit and the electrical connection thereof with said electric device;
- and
- fixing said integrated circuit to said electric device by curing another of said different substances in a second curing condition different than said first curing condition,
- wherein the proportion of said different substance curable in said first condition is 2% to 20% of said mixture.
A method of mounting an IC chip on a substrate comprising the steps of:
- placing an IC chip on a substrate having wirings with a curable adhesive mixture therebetween so that terminals of said IC chip are coupled with corresponding terminals of said wirings, said adhesive mixture comprising two different adhesives which are curable by different conditions;
- curing one of said adhesives in order to temporarily attach said chip to said substrate;
- testing an operation of said IC chip;
- and
- curing the other one of said adhesives in order to tightly attach said chip to said substrate.
Dependencies are inferred from the claim text.