Method and Device for Separating a Semiconductor Component From a Carrier
AssigneePac Tech—Packaging Technologies GmbH
InventorsMatthias Fettke, Andrej Kolbasow
Life of this patent
Estimating the term…
Abstract
A method for separating a semiconductor component from a carrier, the semiconductor component being held in a material-bonded manner in a connection plane on a carrier by a metalliferous connective agent. The connective agent is liquified and the semiconductor component is taken hold of by a holding tool. The holding tool is oscillated. The holding tool is displaced and the semiconductor component is separated from the carrier. Furthermore, a device for separating a semiconductor component held in a material-bonded manner on a carrier by a connective agent, in which the device comprises a holding tool and at least one drive.
Claims19
A method for separating a semiconductor component from a carrier, the semiconductor component being held in a material-bonded manner in a connection plane on a carrier by a metalliferous connective agent, the method comprising the following steps:
- a. liquefying the connective agent and taking hold of the semiconductor component by a holding tool;
- b. oscillating the holding tool;
- and
- c. displacing the holding tool and separating the semiconductor component from the carrier.
A device for separating a semiconductor component held in a material-bonded manner on a carrier by a connective agent, the device comprising a holding tool and at least one drive, the holding tool having a holding plane,
- wherein
- the device comprises an oscillator.
Dependencies are inferred from the claim text.