Micro-transfer-print repair on same site

An interconnected system, comprising:

• a target substrate having a device location, a first contact location in, on, or adjacent to the device location, and a second contact location in, on, or adjacent to the device location, wherein the first contact location is spatially separate from the second contact location;
• a second device disposed at least partially in the device location;
• a damaged or disconnected first connection to the first contact location;
• and
• a second connection connecting the second contact location to the second device.

A method of repairing a micro-transfer-printed system, the method comprising

• providing a target substrate having a target-substrate surface and a first contact location;
• disposing a first device onto the target-substrate surface, the first device comprising a first device contact pad;
• connecting the first device to the target substrate by patterning a metal layer to form a patterned first connection from the first device contact pad to the target-substrate surface;
• disposing a second device onto the target-substrate surface, the second device comprising a second device contact pad;
• and
• connecting the second device by forming a patterned second connection from the second device contact pad to the target-substrate surface.