Soldering/unsoldering arrangement
AssigneeCooper Tools GmbH
InventorJürgen Straub
Life of this patent
Estimating the term…
Abstract
A soldering/desoldering device, in particular for integrated circuits with electric/electronic components, comprises a heater nozzle having a substantially bell-shaped housing formed with a lower nozzle opening. A heat distribution plate which can be acted upon by hot gas is arranged in the heater nozzle. An edge of the heat distribution plate and the housing have formed thereinbetween at least one passage opening for hot gas flowing towards the nozzle opening. In order to attain a uniform heat distribution for soldering or desoldering purposes and to simultaneously reduce the discharge of hot gas from the heater nozzle, at least one return opening for hot gas flowing through the passage opening is disposed in spaced-apart relationship with the passage opening in the heat distribution plate.
Claims35
A soldering/desoldering device (1), for integrated circuits (2) with electric/electronic components (3), comprising a heater nozzle (6) with a substantially bell-shaped housing (5) formed with a lower nozzle opening (4), said heater nozzle (6) having disposed therein a heat distribution plate (8) which can be acted upon by a hot gas (7), and an edge (9) of the heat distribution plate (8) and the housing (5) having formed thereinbetween at least one passage opening (10) for hot gas flowing towards the nozzle opening (4),
- characterized in
- that at least one return opening (11) for hot gas (7) flowing through the passage opening (10) is disposed in spaced-apart relationship with the passage opening (10) in the heat distribution plate (8) and spaced substantially inwardly from said passage opening, said return opening venting said hot gas from said nozzle opening after said hot air has flown over the top of said component.
A device for soldering/desoldering an integrated circuit component to/from a printed circuit board, comprising:
- a heater nozzle housing having an inner peripheral wall substantially surrounding a nozzle opening on a distal end thereof;
- a heat distribution plate disposed within said heater nozzle housing upstream from said nozzle opening;
- a first inlet passage defined at least partially by said heat distribution plate, said first inlet passage opening into a peripheral portion of said nozzle opening;
- a second inlet passage defined at least partially by said heat distribution plate, said second inlet passage opening into a peripheral portion of said nozzle opening opposite said first inlet passage;
- at least one exhaust passage extending through said heat distribution plate and communicating with said nozzle opening at a position substantially inward from said inner peripheral wall;
- a hot air supply communicating with said nozzle opening via said first and second inlet passages;
- wherein, with said nozzle opening placed over the integrated circuit component and abutting the printed circuit board, hot air flows from said hot air supply, through said first and second inlet passages into said nozzle opening, over at least a portion of the top of the integrated circuit component, and out of said nozzle opening via said at least one exhaust passage.
Dependencies are inferred from the claim text.