Epoxy dispensing device and method of mounting electronic component on substrate by using the same
AssigneeElectronics and Telecommunications Research Institute
InventorsHaechung Kang, Eun Kyu Kang, Jong Jin Lee, Sangjin Kwon, Won-Bae Kwon, Dae Woong Moon, Soo Yong Jung, Gye Sul Cho
Life of this patent
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Abstract
An epoxy dispensing device is provided. The epoxy dispensing device includes a cylinder configured to accommodate epoxy, a lower cover configured to seal a lower portion of the cylinder, and a pin disposed under the lower cover, wherein the pin pushes up the lower cover to coat the epoxy on a lower surface of an electronic component mounted in a dispensing port formed in an upper portion of the cylinder.
Claims11
An epoxy dispensing device comprising:
- a cylinder configured to accommodate epoxy;
- a lower cover configured to seal a lower portion of the cylinder;
- and
- a pin disposed under the lower cover,
- wherein the pin pushes up the lower cover to coat the epoxy on a lower surface of an electronic component mounted in a dispensing port formed in an upper portion of the cylinder.
A method of mounting an electronic component on a substrate by using an epoxy dispensing device, the method comprising:
- a step of mounting an electronic component in a dispensing port formed in an upper portion of an epoxy dispensing cylinder;
- a step of pushing up a lower cover formed under the epoxy dispensing cylinder by using a pin to dispense the epoxy through the dispensing port;
- a step of coating the epoxy on a lower surface of the electronic component mounted in the dispensing port by using the dispensed epoxy;
- and
- a step of moving the epoxy-coated electronic component to a mounting position of the electronic component by using a pickup device, and then, curing the epoxy coated on the lower surface of the electronic component with ultraviolet to fix to the substrate.
A method of mounting an electronic component on a substrate by using an epoxy dispensing device, the method comprising:
- a step of pushing up a lower cover formed under an epoxy dispensing cylinder by using a pin to dispense epoxy through a dispensing port;
- a step of mounting an electronic component in the dispensing port;
- a step of coating the epoxy on a lower surface of the electronic component mounted in the dispensing port;
- and
- a step of moving the epoxy-coated electronic component to a mounting position of the electronic component by using a pickup device, and then, curing the epoxy coated on the lower surface of the electronic component with ultraviolet to fix to the substrate.
Dependencies are inferred from the claim text.