Component mounting apparatus

A component mounting apparatus comprising:

• a component feed unit in which a plurality of components are feedably placed;
• a board holding unit for holding a board on which the components are to be mounted;
• a bonding-assistant agent supply unit which contains a bonding-assistant agent serving as an auxiliary agent for bonding by heating between a plurality of bump electrode portions and the board in a contact state thereof, the bump electrode portions being formed on mounting-side surfaces of the components to be mounted onto the board, and which supplies the bonding-assistant agent to the bump electrode portions by bringing the bonding-assistant agent into contact with the individual bump electrode portions;
• a transfer unit for holding and extracting the component placed in the component feed unit and transferring the component to the bonding-assistant agent supply unit so that the bonding-assistant agent is supplied to the individual bump electrode portions;
• and
• a mounting head unit for holding and extracting the component, which has been supplied with the bonding-assistant agent, from the bonding-assistant agent supply unit and mounting the component onto the board held by the board holding unit via the individual bump electrode portions, wherein
• the bonding-assistant agent supply unit comprises:
• a bonding-assistant agent containing section in which the component is placed and which contains the bonding-assistant agent so that the bonding-assistant agent is supplied through the contact by placing the component;
• and
• a containing-section moving unit for reciprocatively moving the bonding-assistant agent containing section between a transfer position (P), at which the component is transferred to the bonding-assistant agent supply unit by the transfer unit, and an extraction position (Q), at which the component supplied with the bonding-assistant agent is extracted from the bonding-assistant agent supply unit by the mounting head unit, and wherein
• during a process of moving the bonding-assistant agent containing section from the transfer position to the extraction position by the containing-section moving unit, the supply of the bonding-assistant agent to the component placed in the bonding-assistant agent containing section is performed.