H05K 13/046
Surface mounting
Official title: {Surface mounting (surface mounted components H05K3/341)}
H05K13/046 (Surface mounting) appears on 994 US grants and 927 published applications in this corpus.
Search patents in H05K- Granted patents
- 994
- Published applications
- 927
- Assignees
- 427
- Inventors
- 1,814
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 13 | 0 |
| 1987 | 13 | 0 |
| 1988 | 17 | 0 |
| 1989 | 17 | 0 |
| 1990 | 19 | 0 |
| 1991 | 19 | 0 |
| 1992 | 24 | 0 |
| 1993 | 21 | 0 |
| 1994 | 26 | 0 |
| 1995 | 10 | 0 |
| 1996 | 6 | 0 |
| 1997 | 8 | 0 |
| 1998 | 8 | 0 |
| 1999 | 12 | 0 |
| 2000 | 15 | 0 |
| 2001 | 15 | 5 |
| 2002 | 13 | 26 |
| 2003 | 23 | 16 |
| 2004 | 14 | 26 |
| 2005 | 18 | 21 |
| 2006 | 12 | 15 |
| 2007 | 12 | 22 |
| 2008 | 9 | 10 |
| 2009 | 8 | 18 |
| 2010 | 12 | 8 |
| 2011 | 13 | 17 |
| 2012 | 9 | 22 |
| 2013 | 15 | 144 |
| 2014 | 48 | 85 |
| 2015 | 72 | 68 |
| 2016 | 64 | 70 |
| 2017 | 60 | 40 |
| 2018 | 39 | 54 |
| 2019 | 47 | 47 |
| 2020 | 52 | 55 |
| 2021 | 41 | 39 |
| 2022 | 43 | 38 |
| 2023 | 30 | 25 |
| 2024 | 25 | 27 |
| 2025 | 29 | 19 |
| 2026 | 8 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Epoxy dispensing device and method of mounting electronic component on substrate by using the same6 Oct 2026US 12,757,367 B2Electronics and Telecommunications Research Institute
- Linear motion device and electronic component mounting device30 Jun 2026US 12,671,304 B2Panasonic Intellectual Property Management Co., Ltd.
- Self-equalizing frame for thermal management device preload16 Jun 2026US 12,660,143 B2Cisco Technology, Inc.
- IC chip-mounting device and IC chip-mounting method26 May 2026US 12,641,766 B2Kabushiki Kaisha Sato
- Wireless communication device manufacturing method and wireless communication device manufacturing apparatus19 May 2026US 12,635,120 B2Murata Manufacturing Co., Ltd.
- Linear motion device and electronic component mounting device24 Sep 2026US 2026/0291355 A1Panasonic Intellectual Property Management Co., Ltd.
- Electrical control unit, manufacturing method for producing an electrical control unit, and a forming tool for producing a control unit20 Aug 2026US 2026/0247536 A1Hella GmbH & Co. KGaA
- Method and device for depositing components on a substrate9 Jul 2026US 2026/0198152 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Component mounting apparatus and determination method25 Jun 2026US 2026/0181848 A1Fuji Corporation
- Method for transferring chips onto a substrate18 Jun 2026US 2026/0173338 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- Apparatus and method for mounting a chip211US 5,839,187 AMatsushita Electric Industrial Co., Ltd. · 1998
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Component mounting method167US 7,353,596 B2Matsushita Electric Industrial Co., Ltd. · 2008
- Component mounting apparatus163US 7,797,820 B2Panasonic Corporation · 2010
- Chip mounting device154US 4,664,309 ARaychem Corporation · 1987