H05K 13/0465
By soldering
Official title: {by soldering (H05K13/0469 takes precedence)}
H05K13/0465 (By soldering) appears on 418 US grants and 325 published applications in this corpus.
Search patents in H05K- Granted patents
- 418
- Published applications
- 325
- Assignees
- 225
- Inventors
- 892
- Latest grant
- 14 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 12 | 0 |
| 1989 | 11 | 0 |
| 1990 | 7 | 0 |
| 1991 | 12 | 0 |
| 1992 | 16 | 0 |
| 1993 | 14 | 0 |
| 1994 | 13 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 7 | 4 |
| 2002 | 7 | 12 |
| 2003 | 14 | 8 |
| 2004 | 7 | 13 |
| 2005 | 12 | 4 |
| 2006 | 3 | 4 |
| 2007 | 5 | 10 |
| 2008 | 2 | 2 |
| 2009 | 5 | 9 |
| 2010 | 1 | 7 |
| 2011 | 4 | 7 |
| 2012 | 4 | 14 |
| 2013 | 7 | 26 |
| 2014 | 20 | 43 |
| 2015 | 20 | 39 |
| 2016 | 28 | 14 |
| 2017 | 31 | 17 |
| 2018 | 17 | 10 |
| 2019 | 11 | 17 |
| 2020 | 15 | 14 |
| 2021 | 12 | 8 |
| 2022 | 12 | 17 |
| 2023 | 15 | 6 |
| 2024 | 6 | 8 |
| 2025 | 7 | 7 |
| 2026 | 0 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System for determining contamination coefficients and/or degrees of contamination in particular during the reflow soldering of printed circuit boards, and associated evaluation unit14 Oct 2025US 12,446,203 B2ERSA GmbH
- Solder printing inspection device30 Sep 2025US 12,432,895 B2Ckd Corporation
- Laser bonding apparatus for three-dimensional molded sculptures19 Aug 2025US 12,390,872 B2Laserssel Co., Ltd.
- Quality determination device and quality determination method5 Aug 2025US 12,377,484 B2Fuji Corporation
- Correction amount calculating device17 Jun 2025US 12,336,109 B2Fuji Corporation
- Electrical control unit, manufacturing method for producing an electrical control unit, and a forming tool for producing a control unit20 Aug 2026US 2026/0247536 A1Hella GmbH & Co. KGaA
- Method and device for depositing components on a substrate9 Jul 2026US 2026/0198152 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Component mounting apparatus and determination method25 Jun 2026US 2026/0181848 A1Fuji Corporation
- Kit for controlling soldered joints on a board23 Apr 2026US 2026/0113918 A1
- Wave height control for wave soldering1 Jan 2026US 2026/0001154 A1Schweitzer Engineering Laboratories, Inc.
Most cited
By later US patents
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Chip mounting device154US 4,664,309 ARaychem Corporation · 1987
- IC chip package having chip attached to and wire bonded within an overlying substrate146US 5,313,096 ADense-Pac Microsystems, Inc. · 1994
- Solder particle deposition90US 5,445,313 AInternational Business Machines Corporation · 1995
- Methods and apparatus for bonding an article to a metallized substrate81US 4,295,596 AWestern Electric Company, Inc. · 1981