Solder particle deposition

A method of depositing particles in a predetermined arrangement on a pick-up surface, comprising the steps:

• providing an enclosure for containing the particles;
• introducing a flow of gas vertically upward through the particles in the enclosure to provide a fluidized bed of particles;
• introducing the pick-up surface into the fluidized bed of particles;
• simultaneously attaching an array of multiple particles in the predetermined arrangement to the pick-up surface in the fluidized bed;
• removing the pick-up surface from the fluidized bed while holding the particles in place on the surface.

Apparatus for depositing particles in a predetermined arrangement on a pick-up surface, comprising:

• an enclosure for containing the particles;
• means for introducing a flow of gas vertically upward through the particles in the enclosure to provide a fluidized bed of particles;
• means for introducing a pick-up surface into the fluidized bed of particles;
• means for attaching an array of multiple particles in a predetermined arrangement to the pick-up surface in the fluidized bed;
• and
• means for removing the pick-up surface from the fluidized bed while holding the particles in place on the surface.

Apparatus for depositing particles onto a substrate surface in a predetermined arrangement of positions, comprising:

• a reservoir for containing the particles;
• means for introducing gas moving upward through the reservoir;
• means for simultaneously picking up a multitude of the particles from the reservoir in an arrangement corresponding to the arrangement of positions on the surface;
• means for positioning the particles adjacent to the substrate surface and aligning the particles with the positions;
• and
• means for releasing the particles onto the substrate surface.

Apparatus, comprising:

• means for maintaining particles in a reservoir in a fluidized form in an upward moving stream of gas;
• means for simultaneously picking up a multitude of particles from the reservoir in an arrangement corresponding to the arrangement of positions on the surface;
• means for positioning the particles adjacent to the substrate surface and aligning the particles with the positions;
• and
• means for releasing the particles onto the substrate surface.

An apparatus for depositing solder particles comprising:

• means for supplying a surface having a plurality of conductive contacts arranged thereon;
• a reservoir for containing solder particles with a size appropriate for the contacts;
• a source of pressurized gas connected to the reservoir;
• means for producing a vacuum;
• a pick-up head having a connection for the vacuum producing means and a surface with a plurality of through holes smaller in size than the solder particles communicating with the vacuum producing means and having an aperture configuration corresponding to the arrangement of the plurality of contacts, the head being capable of being positioned in a first position at the reservoir to pick up the particles and a second position adjacent the supplied surface to deposit the particles;
• means for dispensing flux onto the surface;
• means to control head movement to transport the particles from the reservoir to the surface;
• means for aligning the apertures with the contacts;
• and
• means for controlling the vacuum to the pick-up head to pick up particles from the reservoir and release the particles on the surface.