Correction amount calculating device

A correction amount calculation device of a board work line that includes a component mounting machine that performs a mounting process of mounting a component on a board on which solder is printed, a reflow furnace that heats the board on which the component is mounted and melt the solder to perform soldering, and an appearance inspection machine that inspects a mounting position of the component, which is subjected to the soldering, the correction amount calculation device comprising:

• control circuitry including:
• a selection section that selects a target component in which a movement amount of the component on the board before and after being conveyed to the reflow furnace is equal to or less than a predetermined allowable value, the selection section measuring the movement amount of the component by comparing an inspection result of the appearance inspection machine before and after being conveyed to the reflow furnace and select, as the target component, the component of which the movement amount is equal to or less than the predetermined allowable value;
• and
• a correction amount calculation section that calculates a correction amount, which is used in the mounting process of a board product to be produced later, regarding a positional deviation amount of the mounting position of the target component selected by the selection section with respect to a target mounting position.