Method for transferring chips onto a substrate
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsSarah RENAULT, Adrien POIZAT
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Abstract
A method for transferring a set of chips onto a substrate is disclosed. The method includes providing a support having a bottom extending parallel to a main plane and a rim including a first panel forming a first wedge and a second panel forming a second wedge. A first chip is placed on the bottom and a force is applied to slide the first chip until it abuts both panels. A second chip is placed on the bottom and slid until it abuts the first panel and a secondary edge of the first chip. The chips are immobilized in the main plane and transferred onto the substrate.
Claims17
1-16. (canceled)
A method for transferring a set of chips onto a substrate, the method comprising:
- providing a support having a bottom extending parallel to a main plane and a rim projecting from the bottom, the rim including a first panel forming a first wedge and a second panel forming a second wedge, the first panel and the second panel extending mainly along respective first and second directions distinct from one another in the main plane;
- placing a first chip of the set of chips on the bottom of the support;
- applying a force to the first chip to slide the first chip until the first chip abuts both the first panel and the second panel of the rim;
- placing a second chip of the set of chips on the bottom of the support;
- applying a force to the second chip to slide the second chip until the second chip abuts the first panel of the rim and a secondary edge of the first chip;
- immobilizing the first chip and the second chip in the main plane;
- and
- transferring the first chip and the second chip onto the substrate.
Dependencies are inferred from the claim text.