H05K 13/0469
By applying a glue or viscous material
Official title: {by applying a glue or viscous material}
H05K13/0469 (By applying a glue or viscous material) appears on 263 US grants and 253 published applications in this corpus.
Search patents in H05K- Granted patents
- 263
- Published applications
- 253
- Assignees
- 137
- Inventors
- 524
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 10 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 1 |
| 2002 | 4 | 11 |
| 2003 | 8 | 5 |
| 2004 | 5 | 9 |
| 2005 | 2 | 12 |
| 2006 | 5 | 3 |
| 2007 | 4 | 7 |
| 2008 | 3 | 4 |
| 2009 | 2 | 6 |
| 2010 | 6 | 0 |
| 2011 | 5 | 4 |
| 2012 | 3 | 4 |
| 2013 | 3 | 12 |
| 2014 | 9 | 20 |
| 2015 | 9 | 16 |
| 2016 | 12 | 14 |
| 2017 | 13 | 11 |
| 2018 | 15 | 16 |
| 2019 | 6 | 20 |
| 2020 | 15 | 19 |
| 2021 | 14 | 15 |
| 2022 | 18 | 13 |
| 2023 | 10 | 13 |
| 2024 | 11 | 8 |
| 2025 | 9 | 8 |
| 2026 | 6 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Epoxy dispensing device and method of mounting electronic component on substrate by using the same6 Oct 2026US 12,757,367 B2Electronics and Telecommunications Research Institute
- IC chip-mounting device and IC chip-mounting method26 May 2026US 12,641,766 B2Kabushiki Kaisha Sato
- Wireless communication device manufacturing method and wireless communication device manufacturing apparatus19 May 2026US 12,635,120 B2Murata Manufacturing Co., Ltd.
- Sticking device24 Mar 2026US 12,583,214 B2Beac Co., Ltd.
- Method for creating interconnections between a substrate and electronic components3 Feb 2026US 12,543,270 B2
- Apparatus, system, and method of providing a circuit board carrier for an underfill system5 Mar 2026US 2026/0068116 A1Jabil Inc.
- Apparatus, system, and method of providing a dispenser of circuit board component underfill5 Feb 2026US 2026/0040517 A1Jabil Inc.
- Photonic semiconductor device and method of manufacture30 Oct 2025US 2025/0334755 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Dispenser and lifting device of dispenser11 Sep 2025US 2025/0287507 A1Illinois Tool Works Inc.
- Apparatus and method for manufacturing display device28 Aug 2025US 2025/0275109 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Method of electrically connecting an integrated circuit to an electric device146US 5,261,156 ASemiconductor Energy Laboratory Co.Ltd. · 1993
- Computer controlled method for dispensing viscous fluid120US 5,711,989 ANordson Corporation · 1998
- Multiple head dispensing system and method111US 6,224,675 B1Speedline Technologies, Inc. · 2001
- Method for rapid dispensing of minute quantities of viscous material106US 5,320,250 AAsymptotic Technologies, Inc. · 1994
- Multiple head dispensing system and method105US 6,007,631 ASpeedline Technologies, Inc. · 1999