Method for creating interconnections between a substrate and electronic components

A method of establishing an interconnect between a substrate and an electronic component populated thereon using a magnetically-alignable anisotropic conductive adhesive (ACA), the method comprising the steps of:

• a) establishing dimensions and location on the substrate of a first component to be placed on and connected to the substrate;
• b) determining placement location of a first magnet corresponding to the dimensions and location established for the component in step a);
• c) determining dimensions and strength of the first magnet in step b);
• d) mapping flux lines of the magnetic field for the first magnet;
• e) repeating steps a)-d) for each additional component to be placed on and connected to the substrate to determine properties and placement location for each additional magnet;
• f) creating a magnetic tray and securing each magnet in the respective placement location on the tray;
• g) creating an alignment tray and adapting the alignment tray to retain the substrate during alignment and curing;
• h) placing the substrate on the alignment tray;
• i) applying the ACA on the substrate in one or more locations where components are to be placed;
• j) populating the substrate with the first and each of the additional components;
• k) assembling the alignment tray and the magnetic tray;
• l) Allowing columns to form in the Z-axis in the ACA;
• and
• m) curing the ACA, thereby establishing the interconnects between the substrate and the first and each of the additional components;
• wherein the alignment tray and the magnetic tray are made of nonmagnetic material and the magnet tray is adapted to receive the first and each of the additional magnets in their respective placement locations on the tray;
• and
• wherein an assembly comprising the magnet tray with magnets, the alignment tray with substrate populated with components and ACA can be placed in a curing oven.