Wireless communication device manufacturing method and wireless communication device manufacturing apparatus

A wireless communication device comprising:

• an antenna member having antenna patterns including first and second coupling portions;
• an RFIC module having a RFIC chip and first and second terminal electrodes connected to the RFIC chip;
• and
• an adhesive member having insulation and bonding the antenna member to the RFIC module,
• wherein the first coupling portion and the first terminal electrode face each other with the adhesive member disposed therebetween,
• wherein the second coupling portion and the second terminal electrode face each other with the adhesive member disposed therebetween,
• wherein, in a stacking direction of the antenna member, the adhesive member, and the RFIC module, the first coupling portion has a size that is larger than a size of the first terminal electrode, and the second coupling portion has a size that is larger than a size of the second terminal electrode, and
• wherein, in the stacking direction, a first region enclosing the first and second terminal electrodes in a minimum area is smaller than the adhesive member and is within a contour line of the adhesive member, and the adhesive member is smaller than a second region enclosing the first and second coupling portions in a minimum area and is within the second region.