IC chip-mounting device and IC chip-mounting method

An IC chip mounting apparatus comprising:

• an ejection unit configured to eject an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material;
• a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of the antenna continuous body, when located at the second position;
• a nozzle attachment to which the plurality of nozzles is attached;
• a rotating unit configured to rotate the nozzle attachment, such that the plurality of nozzles moves, on a surface orthogonal to the conveying surface, along a circular track, and a moving direction of each nozzle at the second position matches the conveying direction of the antenna continuous body;
• and
• a processor, wherein the processor is configured to:
• determine whether an IC chip is sucked by each nozzle while each nozzle is moved from the first position to the second position;
• and
• control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.