Universal Instruments Corporation
Conklin, NY, US· latest recorded location
Universal Instruments Corporation is named on 152 US grants and 40 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 152
- Published applications
- 40
- Inventors
- 117
- Granted in 2026 so far
- 0
- Most recent grant
- 13 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 5 | 0 |
| 1978 | 1 | 0 |
| 1979 | 5 | 0 |
| 1980 | 2 | 0 |
| 1981 | 8 | 0 |
| 1982 | 6 | 0 |
| 1983 | 7 | 0 |
| 1984 | 6 | 0 |
| 1985 | 10 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 3 | 0 |
| 1991 | 10 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 4 |
| 2006 | 4 | 2 |
| 2007 | 3 | 0 |
| 2008 | 1 | 2 |
| 2009 | 0 | 2 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 2 | 2 |
| 2013 | 1 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 8 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 5 | 1 |
| 2019 | 1 | 2 |
| 2020 | 0 | 10 |
| 2021 | 5 | 2 |
| 2022 | 10 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 192 documents
- H05KPrinted circuits140
- Y10TTechnical subjects covered by former us classification94
- B65GTransport or storage devices41
- B23PMetal-working not otherwise provided for18
- B25JManipulators12
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered12
- G01CMeasuring distances, levels or bearings10
- G05BControl or regulating systems in general8
- H02PControl or regulation of electric motors, electric generators or dynamo-electric converters6
- B23QDetails, components, or accessories for machine tools5
Recent patents
- Clinch mechanism for assembling a printed circuit board with electronic components13 Feb 2024US 11,903,137 B2
- Dispensing head, nozzle and method4 Oct 2022US 11,464,146 B2
- Spindle module, pick-and-place machine and method of assembly4 Oct 2022US 11,464,147 B2
- Spindle module, bank, and method27 Sep 2022US 11,457,549 B2
- Spindle bank, pick-and-place machine and method of assembly9 Aug 2022US 11,412,646 B2
- Placement alignment method and system15 Jan 2026US 2026/0017776 A1
- Spindle bank, pick-and-place machine and method25 Feb 2021US 2021/0059087 A1
- Dispensing head, nozzle and method7 Jan 2021US 2021/0007253 A1
- Spindle module, bank, and method31 Dec 2020US 2020/0407176 A1
- Spindle module, pick-and-place machine and method31 Dec 2020US 2020/0413580 A1
Most cited
By later US patents
- Real time computer control system for automatic machines131US 4,124,887 A1978
- Method and apparatus for dispensing fluid dots68US 5,452,824 A1995
- System and method for locating solder bumps on semiconductor chips or chip carriers67US 5,694,482 A1997
- Dispenser and method for dispensing viscous fluids55US 5,699,934 A1997
- Centering device for automatic placement of chip components in hybrid circuits54US 4,135,630 A1979