Centering device for automatic placement of chip components in hybrid circuits

A centering device for centering an attached component chip on the spindle of a substrate assembly apparatus, comprising:

• a spindle having a tip at one extremity suited for attachment and holding thereto of said component chip;
• a spindle housing enclosing and aligned with said spindle, said spindle tip extended beyond said spindle housing;
• means for centering said component chip on said spindle tip, said means for centering being withdrawn from said spindle tip during the process of attachment of said component chip, said means for centering acting on said component chip after attachment, said means for centering including:
• a pair of opposed first axis locators pivotably and concentrically suspended at one end from said spindle housing, the other end of said first axis locators being adjacent to said spindle tip;
• a pair of opposed second axis locators pivotably and concentrically suspended at said one end from said spindle housing, the other end of said second axis locators being adjacent to said spindle tip, the axes for pivoting of said first axis locators being perpendicular to the axes for pivoting of said second axis locators;
• means to pivot said first and second axis locators, whereby when pivoted inwardly toward said spindle, said other ends of said axis locators adjacent to said spindle tip contact said attached component chip, pushing said chip into concentricity with said spindle and said spindle housing;
• whereby said component chip need not be centered relative to said spindle tip at the moment of attachment and imprecise storage of said component chip is permitted.