Spindle module, bank, and method
AssigneeUniversal Instruments Corporation
InventorsJohn Danek, Peter Joseph Dionne
Life of this patent
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AssigneeUniversal Instruments Corporation
InventorsJohn Danek, Peter Joseph Dionne
Estimating the term…
A pick-and-place spindle module comprises: a modular body structure including a first receiving location configured to receive a spindle; a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis; a first theta motor configured to rotate a spindle received in the receiving location; a first motion control chip each attached to the body structure, the first motion control chip configured to control the first z-axis motor and the first theta motor; and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank.
A pick-and-place spindle module comprising:
A pick-and-place spindle bank comprising:
A pick-and-place head comprising:
A method of assembly comprising:
Dependencies are inferred from the claim text.