H05K 13/0452
Mounting machines or lines comprising a plurality of tools for guiding different
Official title: {Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place (H05K13/0406, H05K13/041 take precedence)}
H05K13/0452 (Mounting machines or lines comprising a plurality of tools for guiding different) appears on 146 US grants and 138 published applications in this corpus.
Search patents in H05K- Granted patents
- 146
- Published applications
- 138
- Assignees
- 53
- Inventors
- 289
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 1 |
| 2002 | 4 | 2 |
| 2003 | 3 | 4 |
| 2004 | 4 | 7 |
| 2005 | 4 | 3 |
| 2006 | 6 | 3 |
| 2007 | 2 | 0 |
| 2008 | 2 | 2 |
| 2009 | 1 | 10 |
| 2010 | 3 | 7 |
| 2011 | 4 | 5 |
| 2012 | 4 | 11 |
| 2013 | 2 | 6 |
| 2014 | 12 | 0 |
| 2015 | 3 | 3 |
| 2016 | 2 | 1 |
| 2017 | 2 | 7 |
| 2018 | 1 | 16 |
| 2019 | 8 | 12 |
| 2020 | 15 | 17 |
| 2021 | 14 | 6 |
| 2022 | 18 | 8 |
| 2023 | 2 | 4 |
| 2024 | 4 | 2 |
| 2025 | 5 | 1 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Component mounting device and component mounting method21 Apr 2026US 12,610,511 B2Panasonic Intellectual Property Management Co., Ltd.
- Supplying components from a continuous material to a placement machine24 Feb 2026US 12,563,712 B2ASMPT GmbH & Co. KG
- Three-dimensional molding machine and component mounting machine6 Jan 2026US 12,520,464 B2Fjui Corporation
- Method for performing online pick-and-place path optimization simultaneously during the production of a surface mount machine16 Dec 2025US 12,501,597 B2Ningbo Yik-Tong Intelligent Technology Co., LTD
- Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component24 Jun 2025US 12,342,467 B2Shin-Etsu Chemical Co., Ltd.
- Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component11 Sep 2025US 2025/0287559 A1Shin-Etsu Chemical Co., Ltd.
- Fluxless gang die bonding arrangement12 Sep 2024US 2024/0304485 A1
- Method for performing online pick-and-place path optimization simultaneously during the production of a surface mount machine18 Jul 2024US 2024/0244814 A1Ningbo Yik-Tong Intelligent Technology Co., LTD
- Supplying components from a continuous material to a placement machine5 Oct 2023US 2023/0320053 A1ASMPT GmbH & Co. KG
- Component mounting system and method for supplying electronic component31 Aug 2023US 2023/0276607 A1Fuji Corporation
Most cited
By later US patents
- Mounting apparatus of electronic components and mounting methods of the same64US 5,864,944 AMatsushita Electric Industrial Co., Ltd. · 1999
- Method and apparatus for electronic component matching49US 4,610,083 AZenith Electronics Corporation · 1986
- Component feeder configuration monitoring49US 6,027,019 A2000
- Electronic components mounting apparatus32US 5,329,692 AMatsushita Electric Industrial Co., Ltd. · 1994
- Electric component mounting apparatus20US 4,999,909 AMatsushita Electric Industrial Co., Ltd. · 1991