Fluxless gang die bonding arrangement

A process for the deposition of ganged assembly of chip die sets on a receiving wafer, comprising:

• picking up pre-assembled die chips serially, from a source supply wafer by a gripper mechanism;
• loading the pre-assembled picked-up die chips onto an elongated gang die chip carrier;
• inverting the elongated gang die chip carrier with its preassembled picked-up die chips thereon;
• and
• depositing the pre-assembled picked-up die chips, upside down from the orientation in which they were picked up by the gripper mechanism, onto a receiver substrate on a receiving chuck for final assembly thereon.

The fluxless manufacture of an integrated circuit for the computer industry, comprising the steps:

• providing a fluxless array of pre-assembled die chips on a donor chuck arrangement;
• picking up a preassembled die chip from the donor chuck arrangement by a gripper, under guidance from a first connected camera connected to a control computer;
• delivering the preassembled die chip in the aligned manner, by the gripper onto a guide camera monitored computer-controlled gang carrier;
• rotationally moving the gang carrier so as to invert the preassembled die chip thereon;
• depositing the inverted die chip assembly onto a receiving chuck, guided positionally by a further guide camera;
• and
• controllably pressing the inverted die chip assembly by a computer-controlled compression rod assembly, thereby compressing each die chip against a receiver substrate supported on the receiver chuck so as to comprise the integrated circuit.