H05K 13/0478
Simultaneously mounting of different components
Official title: {Simultaneously mounting of different components}
H05K13/0478 (Simultaneously mounting of different components) appears on 118 US grants and 55 published applications in this corpus.
Search patents in H05K- Granted patents
- 118
- Published applications
- 55
- Assignees
- 80
- Inventors
- 273
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 8 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 3 |
| 2003 | 2 | 0 |
| 2004 | 4 | 2 |
| 2005 | 2 | 2 |
| 2006 | 1 | 1 |
| 2007 | 0 | 2 |
| 2008 | 2 | 2 |
| 2009 | 0 | 1 |
| 2010 | 2 | 4 |
| 2011 | 2 | 0 |
| 2012 | 3 | 3 |
| 2013 | 2 | 1 |
| 2014 | 1 | 3 |
| 2015 | 1 | 2 |
| 2016 | 1 | 0 |
| 2017 | 1 | 2 |
| 2018 | 1 | 1 |
| 2019 | 0 | 4 |
| 2020 | 3 | 2 |
| 2021 | 3 | 7 |
| 2022 | 4 | 4 |
| 2023 | 2 | 3 |
| 2024 | 4 | 1 |
| 2025 | 2 | 3 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Micro-transfer printing from adhesive surfaces19 May 2026US 12,629,930 B2X-Celeprint Limited
- Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panel25 Mar 2025US 12,261,071 B2Asti Global Inc., Taiwan
- Method of manufacturing an electronic device7 Jan 2025US 12,193,167 B2Innolux Corporation
- Device for self-assembling semiconductor light-emitting diodes3 Dec 2024US 12,159,800 B2LG Electronics Inc.
- Electronic component mounting device for mounting electronic components at certain intervals10 Sep 2024US 12,089,340 B2Hallys Corporation
- Micro-transfer printing from adhesive surfaces27 Aug 2026US 2026/0249606 A1X-Celeprint Limited
- Component mounting equipment24 Jul 2025US 2025/0240935 A1Hanwha Precision Machinery Co., Ltd.
- Electronic-component batch transfer method and system24 Jul 2025US 2025/0240936 A1Innostar service Inc.
- Method of manufacturing an electronic device13 Mar 2025US 2025/0089178 A1Innolux Corporation
- Method of manufacturing an electronic device15 Feb 2024US 2024/0057264 A1Innolux Corporation
Most cited
By later US patents
- Method and apparatus for the assembly of microfabricated devices153US 5,355,577 A1994
- Device for assembling pins onto a circuit board background91US 7,735,217 B2MC Technology GmbH · 2010
- Device for the simultaneous mounting of components on a carrier85US 4,465,206 AU. S. Philips Corporation · 1984
- Automatic assembly of integrated circuits58US 4,627,151 AThomson Components-Mostek Corporation · 1986
- Multi-spindle pick and place method and apparatus48US 5,040,291 AUniversal Instruments Corporation · 1991