Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panel

An electronic component transfer method, comprising:

• providing a flexible carrier carrying an electronic component on a surface thereof;
• providing a target substrate disposed with a bonding pad on a surface thereof;
• disposing the surface of the flexible carrier carrying the electronic component opposite to the surface of the target substrate disposed with the bonding pad, and disposing a solder on at least one of the electronic component and the bonding pad;
• providing an abutting component, allowing light to pass through, having an abutting end, and located at an original position;
• moving the abutting component away from the original position towards a surface of the flexible carrier not carrying the electronic component, and abutting against the surface with the abutting end, so that the flexible carrier is deformed, and the electronic component is moved towards the target substrate;
• capturing an image of a position of the electronic component through the abutting end of the abutting component by generating a light beam through the abutting end of the abutting component;
• computing an offset vector of the position of the electronic component;
• changing as necessary a relative position between the abutting end of the abutting component and the flexible carrier according to the offset vector, so as to correct the offset vector;
• providing an energy beam, directing the energy beam to pass through the abutting component to melt the solder between the electronic component and the bonding pad, and soldering and fixing the electronic component on the target substrate by the solder;
• and
• returning the abutting component to the original position.