Method of manufacturing an electronic device
AssigneeInnolux Corporation
InventorsKai Cheng, Fang-Ying Lin, Tsau-Hua Hsieh
Life of this patent
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Abstract
A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.
Claims10
A method of manufacturing an electronic device, comprising:
- providing a plurality of first electronic components;
- transferring the plurality of first electronic components onto a plurality of pickup sites;
- figuring out a defected electronic component from the plurality of first electronic components;
- removing the defected electronic component to provide an empty pickup site among the plurality of pickup sites;
- transferring a second electronic component onto the empty pickup site;
- providing a target substrate;
- and
- transferring the plurality of first electronic components and the second electronic component onto the target substrate.
Dependencies are inferred from the claim text.